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Abstract:
In this paper, the dynamic dissolution of the base metal into the
moten solder has been studied, and a numerical simulation model of
dissolution velue has been developed. A method for measuring the
solution speed ratio was build. The numerical simulation results have
been borne out by the tests.
Key words:
Laser Soldering
Dissolution
国家自然科学基金资助项目. Received 19910715,
received in revised form 19911102
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