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  HomeContents of Chinese Journal of Mechanical Engineering 1993 No.2DYNAMIC DISSOLUTION OF THE BASE METAL INTO THE MOTEN SOLDER IN SMT LASER MICROSOLDERING

DYNAMIC DISSOLUTION OF THE BASE METAL INTO THE MOTEN SOLDER IN SMT LASER MICROSOLDERING

 

Wang Chunqing  Qian Yiyu  Jiang Yihong

(Harbin Institute of Technology)

 

Abstract: In this paper, the dynamic dissolution of the base metal into the moten solder has been studied, and a numerical simulation model of dissolution velue has been developed. A method for measuring the solution speed ratio was build. The numerical simulation results have been borne out by the tests.
Key words: Laser  Soldering  Dissolution
国家自然科学基金资助项目. Received 19910715, received in revised form 19911102

 

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