Home|News|Literature|Journal|Instruction|Forum|Member|Introduction

Chinese  Old version

By    In    Search 

  HomeContents of Chinese Journal of Mechanical Engineering 2002 No.3numerical simulation on electro-thermal stress around crack tip in metal thin plate with crack
numerical simulation on electro-thermal stress around crack tip in metal thin plate with crack

 

Zheng Lijuan  Fu Yuming  Bai Xiangzhong  Tian Zhenguo

(Yanshan University)

 

Abstract: The couple of current, temperature and stress are studied in metal thin plate with crack at the moment while pulse current is switched on. In analysis, the finite methods are used. The analysis process is composed of the thermal-electrical coupled and thermal-mechanical coupled. The evolutive process of current-temperature-stress is simulated in numerical analysis, the thermal stress around crack is solved at the moment while the pulse current is switched on. The temperature field and stress field results of numerical simulation correspond to the results of theoretical analysis.

Key words: Crack arresting  Pulse current discharge  Temperature field  Thermal stress field 

CLC No: O482.6  O346.1

国家自然科学基金(19772046)和河北省自然科学基金资助项目(599255). Received 20010228, received in revised form 20010604

 

Open or Download Full Text of this Paper (PDF File)
 
  About us-Contact us-Site map-Advertisement service-Cooperation-Legal statement  

Address: 22 Baiwanzhuang Dajie, Beijing 100037 China    Tel: 8610-88379907    Fax: 8610-68994557

E-mail: cjme@mail.machineinfo.gov.cn  http: //www.cjmenet.com
©2006 Editorial Office of CJME. All Right Reserved