Sub-nanometer Precision Polishing of

Computer Rigid Disk Substrate

Lei Hong

(Research Center of Nano-science and Nano-technology, Shanghai University, Shanghai 200436)

Luo Jianbin

(State Key Laboratory of Tribology, Tsinghua University, Beijing 100084)

Tu Xifu  Fang Liang

(Shenzhen Kaifa Magnetic Recording Co., LTD, Shenzhen 518035)

Abstract: With magnetic heads operating closer to hard disks, the hard disks are forced to be ultra-smooth. At present, chemical-mechanical polishing (CMP) has become a widely accepted global planarization technology. CMP(Chemical-mechan-ical polishing) of computer rigid disk substrate in the slurry containing nano-scale SiO2 particle is studied. Results indicated that the average roughness (Ra) and the average waviness (Wa) of the polished surfaces as well as material removal amount were much dependent on the particle size and the contents of the particle and oxidant. Based on Auger electron spectrogram (AES) examinations of the chemical changes in the polished surfaces with the prepared slurry, the CMP mechanism is deduced preliminarily.

Key words: Chemical-mechanical polishing (CMP)  Rigid disk substrate  Sub-nanometer roughness  CMP mechanism

CLC No: TH117

上海市纳米专项(0352nm058)和国家自然科学基金(50390060)资助项目. Received 20040406, received in revised form 20040914