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  HomeContents of Chinese Journal of Mechanical Engineering 2005 No.3EXPERIMENTAL STUDY ON THERMAL BONDING FOR PLASTIC CAPILLARY ELECTROPHORESIS CHIPS

EXPERIMENTAL STUDY ON THERMAL BONDING FOR

PLASTIC CAPILLARY ELECTROPHORESIS CHIPS

 

Yu Jianqun

(School of Biological and Agricultural Engineering, Jilin University, Changchun 130025)

Liu Junshan  Wang Liding  Guo Lisha

(School of Mechanical Engineering, Dalian University of Technology, Dalian 116023)

 

Abstract: A plastic capillary electrophoresis chip is a novel kind of miniaturized device for biochemistry analysis. The major advantages of the chip include high transmittance for light; low conductivity for electrokinetic pumping and electrophoretic separation; low cost for high volume production and disposal and easily manufacturing for high aspect ratio of microchannels on the chip. A process of thermal bonding for plastic capillary electrophoresis chips is studied, the relationships between the changes of the dimensions of the microchannels and the process conditions of thermal bonding and hot embossing, including temperature, pressure and time are established by experiment, based on these the ways to reduce the changes are proposed, which lays the foundation for basic theories and techniques of structural design and manufactures of the plastic chip.

Key words: Capillary electrophoresis chips  Microfluidic chips  Biochips  m-TAS  MEMS   Microfabrication  Thermal bonding

CLC No: TN271

中国博士后科学基金和吉林省科技发展计划资助项目(20020610). Received 20040413, received in revised form 20041026

 
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