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  HomeContents of Chinese Journal of Mechanical Engineering 2005 No.7Behavior of Oxide Film and ELIMINATION OF MICROVOID during Vacuum-free Vibration Liquid Phase Diffusion Bonding of SiCp/ZL101A COMPOSITES

Behavior of Oxide Film and ELIMINATION OF MICROVOID during Vacuum-free Vibration
Liquid Phase Diffusion Bonding of

SiCp/ZL101A COMPOSITES

 

Xu Huibin  Yan Jiuchun  Yang Shiqin

(National Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001)

 

Abstract: The elimination of void and oxide film removal mechanism is researched in vacuum-free vibration liquid phase diffusion bonding of SiCp/ZL101A composites. Experimental results show that effect of elimination of void and oxide film removal is remarkable in the condition of vibration. Moreover, elimination of void and oxide film removal is accelerated under existence of liquid state eutectic interlayer. The elimination of void and oxide film removing model under solid state and the one under the coexistence solid and liquid phase are successively developed on basis of the above results.

Key words: Aluminum matrix composites  Vacuum-free  Vibration  Bonding  Oxide film

CLC No: TG453+.9

国家自然科学基金资助项目(50375039). Received 20040102, received in revised form 20050228

 
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