EFFECT ON EXTRUSION TEMPERATURE FOR PHYSICAL PROPERTIES OF HIGH-SILICON ALUMINUM ALLOY

YANG Fuliang  GAN Weiping  CHEN Zhaoke

(School of Materials Science and Engineering, Central South University, Changsha 410083)

Abstract: Light weight high-silicon aluminum alloys are used for electronic packaging in the aviation and space-flight. Al-30Si and Al-40Si are fabricated with air-atomization and vacuum canning hot-extrusion process. Material density, thermal conductivity, hermeticity and thermal expansion coefficient are also measured, and the relationship of extrusion temperature and properties are obtained. Experimental results show that the density of high-silicon aluminum alloys prepared with the method is high to 99.64% of the theory density, and it increases with elevating extrusion temperature, at the same time, thermal conductivity which varies between 104~140 W/(m·K) with the extrusion temperature and thermal expansion coefficient also increases, but it is within 13×10–6(at 100 ℃), and the hermeticity of the material is high to 10–9.

Key words: Rapid solidification   Vacuum canning  Hot extrusion  Al-Si alloy  Gas sealed  Thermal conductivity  Electronic package

CLC No: TF112  TG337

国防科学技术工业委员会资助项目(MKPT-03-151). Received 20050620, received in revised form 20051110