Home|News|Literature|Journal|Instruction|Forum|Member|Introduction

Chinese  Old version

By    In    Search 

  HomeContents of Chinese Journal of Mechanical Engineering 2006 No.7MICROSTRUCTURE DEVELOPING MECHANISM IN SELECTIVE LASER SINTERING OF MULTI-COMPONENT Cu-BASED ALLOY POWDER
MICROSTRUCTURE DEVELOPING MECHANISM IN SELECTIVE LASER SINTERING OF MULTI-COMPONENT
Cu-BASED ALLOY POWDER

 

SHEN Yifu1  GU Dongdong1  ZHAO Jianfeng2  HUANG Yinhui2  YANG Jialin3  WANG Yang3

(1. College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 210016;

2. College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016;

3. Institute of Machinery Manufacturing Technology, China Academy of Engineering Physics,Mianyang 621900)

 

Abstract: Selective laser sintering of a multi-component Cu-based metal powder with the Cu, CuSn and CuP weight ratio of 55∶35∶10 has been successfully processed. The CuSn metal powder with a lower melting point acts as the binder, while the Cu powder with a higher melting point acts as the structural metal. The CuP powder is taken as a fluxing agent to improve the wetting characteristics. The dominant sintering mechanism is liquid formation and particle rearrangement. Care should be taken to determine the suitable processing param-

eters (laser power of 275~400 W and scan speed of 0.03~0.06 m·s–1) in order to ensure the melting of the binder CuSn but the non-melting of the structural metal Cu. Under condition that the mechanism of liquid phase sintering with partial melting of the powder prevails, increasing laser power or decreasing scan speed can generally improve sintering density and structural homogeneity.

Key words:selective laser sintering  Cu-based metal powder  Sintering mechanism  Liquid phase sintering   Processing parameters

CLC No: TG14  TG66

国家自然科学基金委员会—中国工程物理研究院联合基金(10276017)、航空科学基金(04H52061)和南京航空航天大学科研创新基金(S0403-061)资助项目. Received 20050624, received in revised form 20060116

  

Open or Download Full Text of this Paper (PDF File)
 
  About us-Contact us-Site map-Advertisement service-Cooperation-Legal statement  

Address: 22 Baiwanzhuang Dajie, Beijing 100037 China    Tel: 8610-88379907    Fax: 8610-68994557

E-mail: cjme@mail.machineinfo.gov.cn  http: //www.cjmenet.com
©2006 Editorial Office of CJME. All Right Reserved