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  HomeContents of Chinese Journal of Mechanical Engineering 2006 No.9EXPERIMENTAL STUDY ON CHIP FORMATION MECHANISM DUE TO SHOCK OF ULTRA-HIGH SPEED GRINDING
EXPERIMENTAL STUDY ON CHIP FORMATION MECHANISM DUE TO SHOCK OF ULTRA-HIGH SPEED GRINDING

 

ZHAO Henghua1  GAO Xingjun1  CAI Guangqi2

(1. School of Mechanical Engineering, Liaoning University of Petroleum & Chemical Technology, Fushun 113001;

2. School of Mechanical Engineering & Automation, Northeastern University, Shenyang 110004)

 

Abstract: According to the theory of ultra-high speed shock, the phenomenon of ultra-high speed grinding from the collision between grain and workpiece is researched. In order to study the chip formation mechanism in ultra-high speed grinding, the experimental study on ultra-high speed shock grinding about four kinds of the engineering material such as carbon steel, natural marble, spring steel and high speed tool steel are performed, which is used veritable amorphous carborundum and CBN grains that adhered to the head of bullet whose size is 7.62 mm as abrasive material, and used the 81 type rifle as accelerator and charger. Some valuable results in experiment of ultra-high speed grinding are acquired and the results are analyzed in detail. The experimental results indicate that in ultra high speed shock grinding the contact point is produced high temperature instantaneously which attached or exceeded its melting point, thereby, the material of the contact zone between the bullet and the steel plate becomes mobile phase and the flow material leaves the matrix and becomes abrasive dust under the action of the grain and shock wave. The phenomenon on chip formation due to shock of ultra-high speed grinding is found, so the chip formation mechanism due to shock of ultra-high speed grinding is studied and disclosed from the deeper level, and the accuracy of “the model of mechanism of chip-formation due to shock in quasi-fluid phase on super-high speed grinding” is verified.

Key words: Ultra-high speed grinding  Chip formation due to shock  Quasi-fluid phase

CLC No: TG580.1

国家自然科学基金(50475052)和辽宁省自然科学基金(20022161)资助项目. Received 20051026,  received in revised form 20060226

 
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