CREEP RUPTURE AND ENHANCEMENT
MECHANISM OF Cu PARTICLE ENHANCEMENT
COMPOSITE SOLDER JOINTS

YAN Yanfu¹  FENG Lifang¹  JI Lianqing²  YAN Hongxing¹  YU Hua¹

(1. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003;
2.College of Mechanical & Electronic Engineering, Zhengzhou University of Light Industry, Zhengzhou 450002)

Abstract: Creep rupture lifetimes of Cu particle enhancement SnPb based composite solder joints and the matrix solder joints are tested under different temperatures and stresses and the creep rupture mechanism is analyzed. Results show that the creep resistance of the composite solder joints is superior to that of the matrix solder joints. It is the main reason that the Cu6Sn5 intermetallic compound layer formed between the matrix and the counteract of Cu particles to creep behavior make for the high creep resistance of the composite solder. A thin Pb-rich phase which lies on the cooper substrate of solder joints cause directly the creep rupture of the solder joints.

Key words: Cu particles  Composite solder  Creep rupture life  Creep rupture  Creep enhancement mechanism

CLC No: TG405

河南省科技攻关(072102260016)和河南科技大学校基金(13420060)资助项目. Received 20061024, received in revised form 20070416