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Abstract: The design of moisture-mildew-saltspray proofing to shipborne electronic equipment is an important mission for the shipborne electronic equipment operating at the ocean environment. It should be considered overall from the materials-application, structure design, process engineering and so on at the time of the product development. The accurate use of metal material with good corrosion resistance and the nonmetal material with good mildew-proofing and aging resistance is the basis of the design. Most corrosion could be avoided by the rational structural design. The rationality of the structural design would affect mostly the adaptive capacity to environment of the product and is the key factor for the moisture-mildew-saltspray proofing design of the shipborne electronic equipment. It would improve the proofing capability farther that the correct use of the material modification, surface coating/depositing, impregnation, encapsulation, insulation process and so on. At present, the coating-film technology would only solve the moisture-mildew-saltspray proofing problem in the circuit component under the L-band, but the encapsulation of application environment of micro/millimeter wave circuit component and the electromagnetic shielding composite technology could prevent effectively the ubiquitous galvanic corrosion, ensure that the component could adapt the inclement environment, and the shielding properties should be above 80 dB during the 0.1~10 GHz operating frequency, and meet the waterproof requirement of the three meter depth impregna-tion. Hermetic package is used at the millimeter-wave T/R components in which the bare chips are micropackaged for the moisture-mildew-saltspray proofing. The helium mass spectrum leakage detection rate should be less than
1×10–8Pa·m3/s of the GJB requirement, which could ensure the reliability of the circuit component.
Key words: Shipborne electronic equipment
Moisture-mildew-saltspray proofing design
Protection technology
Micro/millimeter wave circuit component
Environment encapsulation and electromagnetic shielding
CLC No: U674.7
2006年中国机械工程学会年会推荐论文. Received 20061205, received in revised form 20061215
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