Fault Prognosis Technology for Solder Joints Based on
Time Stress and Hidden Markov Models

LÜ Kehong  QIU Jing  LIU Guanjun

(College of Mechatronics Engineering & Automatization, National University of Defense Technology, Changsha 410073)

Abstract: The main external factor of solder joints degradation or deviation from an expected normal condition is the time stress such as work and environment stresses. A damage assessment method for solder joints based on time stress monitoring and three-dimensional finite element model is introduced. A damage-fault evolution model of solder joints based on hidden Markov models (HMM) is put forward. And then, the fault prognosis technology of the solder joints is researched based on the HMM model, real-time damage information and life consumption prognosis method. The detailed process and algorithm of the fault prognosis technology are studied based on time stress monitoring. Finally, the validity of the technology is proved by an experimental study of plastic quad flat package (PQFP) solder joints.

Key words: Fault prognosis  Time stress  Hidden  Markov models (HMM)  Solder joints

CLC No: TP277

Received 20070509, received in revised form 20071106

References

[1] SATCHIDANANDA M, SATCHIDANANDA G, PECHT M, et al. Life consumption monitoring for electronics prognostics[C]//Proceedings of the IEEE Aerospace    Conference. Big Sky, Montana, USA. 2004: 3 455-3 467.
 [2] RAMAKRISHNAN A, PECHT M, A life consumption monitoring methodology for electronic systems[J]. IEEE Transactions on Components and Packaging Technologies, 2003, 26(3): 625-634.
 [3] HAN Changying. Failure mechanism and reliability evaluation of the surface assembly parts[J]. Electronic Product Reliablity and Environental Testing, 1992(3): 2-6.
 [4] CHU Weihua. Test method research on reliability enhancement testing for module-level electronic products[D]. Changsha: National University of Defense Technology, 2003.
 [5] WANG Kao. Optimization of test profile and feasibility analysis of defect activation for PQFP[D]. Changsha: National University of Defense Technology, 2003.
 [6] YAN Jianhong. Physical basis of failure[M]. YANG Jiajian, GUAN Chengxun, translated. Beijing: Science Press, 1982.
 [7] NI Kan. Advances in stochastic theory of fatigue damage accumulation[J]. Advances in Mechanics, 1999(2): 43-65.
 [8] XIE Jinhui. Application of hidden Markov model in speech signal processing[M]. Wuhan: Huazhong University of Science and Technology Press, 1995.
 [9] YI Kechu, TIAN Bin, FU Qiang. Speech signal processing[M]. Beijing: Publishing House of National Defense Industry, 2000.
[10]  LIU Xinming. Research on diagnosing intermittent faults to reduce false alarms of mechatronics BIT[D]. Changsha: National University of Defense Technology, 2005.
[11] Deliverable report 16 of the environmental life cycle information management and acquisition for consumer products[R]. Project Funded By the European Community under the Competitive and Sustainable Growth Program, 2005.
[12] MISHRA S, PECHT M, SMITH T, et al. Life consumption monitoring approach for remianing life estimation[C]//European Microeletronics Packaging and Inter- connection Symposium. Cracow, Poland. 2002: 136-142.