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  HomeContents of Chinese Journal of Mechanical Engineering (English Edition),1998 No.4ANALYSIS ON LAPPING AND POLISHING PRESSURE DISTRIBUTION OF HARD MAGNETIC DISK SUBSTRATE
ANALYSIS ON LAPPING AND POLISHING

PRESSURE DISTRIBUTION OF HARD

MAGNETIC DISK SUBSTRATE

 

Cai Guangqi  Cai Rui  Lu Yushan  Min Xinli
School of Mechanical Engineering and Automation, Northeastern University

 

Abstract: The contact model of lapping and polishing for magnetic disk substrate is presented. Based on elastic contact theory. Pressure distribution for this model are analyzed. Further, the effects of various parameters ,such as the material properties of the PVA (polyvinyl acetate), grinding stone, the polishing pad and the base plate, the thickness of the pad or the stone on the pressure distribution have been discussed.

Key words: Lapping  Polishing  Magnetic disk substrate


Manuscript received on March 18, 1997; revised manuscript April 6, 1998

 

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