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  HomeContents of Chinese Journal of Mechanical Engineering (English Edition),2000 No.2THERMAL PROCESS OF VACUUM FLUXLESS LASER SOLDERING AND ANALYSIS ON SOLDER SPREADING AND WETTING
THERMAL PROCESS OF VACUUM FLUXLESS LASER SOLDERING AND ANALYSIS ON SOLDER

SPREADING AND WETTING*

 

Wang Chunqing  Li Mingyu  Sun Fujiang  Feng Wufeng
 National key laboratory of welding, Harbin Institute of Technology

 

Abstract: In order to study the mechanism of vacuum fluxless soldering on the conditions of laser heating, the method of measuring temperature by the thermocouple is used to analyze the spreading and wetting process of both fluxless Sn-Pb solder in the vacuum surroundings and flux Sn-Pb solder on Cu pad. Solder spreading and wetting affected by the soldering thermal process is also discussed according to the thermodynamics principle. Results show that vacuum fluxless soldering demands higher temperature, and the fall of the solder surface tension is the important factor achieving fluxless laser soldering.

Key words: Fluxless soldering  Soldering thermal process  Spreading and wetting


* This project is supported by National Natural Science Foundation of China. Manuscript received on March 25, 1999; revised manuscript July 15, 1999

 

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