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  HomeContents of Chinese Journal of Mechanical Engineering (English Edition),2004 No.3Finite Element Analysis of Substrate Local Plastic Deformation Induced by Cracked Thin Hard Film

Zhu Youli

Faculty of Materials Science

and Engineering,

Academy of Armored Force Engineering,

Beijing 100072, China

 

Rożniatowski K

 

Kurzydłowski K

Faculty of Materials Science

and Engineering,

Warsaw University of Technology,

Warsaw 00-661, Poland

 

Huang Yuanlin

 

Xu Binshi

Faculty of Materials Science

and Engineering,

Academy of Armored Force Engineering,

Beijing 100072, China

 

 

Finite Element Analysis of
Substrate Local Plastic
Deformation Induced by
Cracked Thin Hard Film
*


Abstract: It has been postulated that, with tensile loading conditions, micro-cracks on thin hard film act as stress concentrators enhancing plastic deformation of the substrate material in their vicinity. Under favorable conditions the localized plastic flow near the cracks may turn into macroscopic plastic strain thus affects the plasticity behaviors of the substrate. This phenomenon is analyzed quantitatively with finite element method with special attention focused on the analysis and discussion of the effects of plastic work hardening rate, film thickness and crack depth on maximum plastic strain, critical loading stress and the size of the local plastic deformation zone. Results show that micro-cracks on thin hard film have unnegligible effects on the plasticity behaviors of the substrate material under tensile loading

Key words: Thin film  Micro-crack  Finite element method  Plastic deformation

 


* This project is supported by National Natural Science Foundation of China (No.59705009). Received January 28, 2003; received in revised form March 10, 2004; accepted April 29, 2004

 

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